Digi ConnectCore® 8M Nano > System-On-Modules

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Digi ConnectCore® 8M Nano 요약정보 및 구매

MODEL : Digi ConnectCore® 8M Nano

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브랜드	DIGI
판매가격	전화문의 (031-713-5988)
포인트	0점
배송정보	유료(주문시 결제) 점포택배 / 평균 7일 이내 도착(토,일,공휴일 제외)

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제품 정보

Digi ConnectCore® 8M 나노

NXP i.MX 8M Nano 프로세서에 기반한 임베디드 시스템-온-모듈은 산업용 IoT 어플리케이션에 적합하도록 긴 수명과 확장성을 위하여 설계되었습니다.

> 산업용 I.MX 8M 나노 쿼드/듀얼 코어 시스템-온-모듈

> Digi SMTplus® 폼 팩터(40mm x 45mm)로 최고의 신뢰성 및 설계 자유도 제공

> 하드웨어 및 소프트웨어 지원을 통한 전원 관리로 저전력 설계 > 하드웨어 가속을 지원하는 멀티 디스플레이 및 카메라 기능> 사전 인증된 듀얼 밴드 802.11a/b/g/n/ac 1x1 및 Bluetooth® 5 연결
> 완벽한 셀룰러 모뎀 및 Digi XBee® 통합 > 클라우드 및 에지 컴퓨팅 서비스 통합 > Digi TrustFence®로 장치 보안, ID 및 개인 정보 보호 기능 내장 > Digi Remote Manager®를 통한 원격 모니터링 및 관리 > Yocto 프로젝트 리눅스 지원

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NXP® i.MX 8M Nano 어플리케이션 프로세서를 기반으로 하는 Digi ConnectCore® 8M Nano는 통합 시스템-온-모듈(SOM) 플랫폼입니다. Nano는 IoT (Internet of Things), HMI (human-machine interface), 장비 모니터링, 오디오(Audio) / 음성(Voice), 엣지 컴퓨팅 및 기계를 포함한 광범위한 산업, 의료, 농업 및 운송 응용 제품을 위해 설계되었습니다.

Digi ConnectCore 8M Nano는 최대 4 배의 전력 효율적인 Arm® Cortex®-A53 코어와 1x Cortex-M7 코어를 갖추고 있어 높은 전력 표준을 유지하면서 전력 소비를 최소화할 수 있습니다. 이 SOM은 산업용으로 적합한 안정성과 임베디드 장치의 10 년 이상의 제품 수명주기를 위해 설계되었습니다. OEM은 사전 인증된 무선 연결, 원격 관리, 클라우드 통합 및 Yocto Project® 기반의 완전한 리눅스 소프트웨어 플랫폼을 활용하여 R&D 및 개발 비용을 절감하고 총 소유 비용을 절감할 수 있습니다. 또한 OEM 개발자는 Digi TrustFence®가 내장되어 있어서 중요한 보안 및 데이터 개인 정보 보호 기능을 제품에 통합할 수 있습니다.

* 시스템-온-모듈 제품별 비교

	Digi ConnectCore 8M Nano Embedded system-on-module based on the NXP i.MX 8M Nano processor; designed for longevity and scalability in industrial IoT applications	Digi ConnectCore 8X Intelligent and connected embedded system-on-module based on the NXP i.MX 8X, with scalable dual/quad-core performance for industrial IoT applications	Digi ConnectCore 6+ NXP i.MX6Plus based surface-mount module solution with scalable, quad-core performance and integrated wireless	Digi ConnectCore 6UL The Industry’s smallest wireless low-power NXP i.MX6UL UltraLite System-on-Module platform to build your intelligent and secure connected devices	Digi ConnectCore 6 NXP i.MX6 based surface-mount module solution with scalable, single-/multi-core performance and integrated wireless
	VIEW PRODUCT	VIEW PRODUCT	VIEW PRODUCT	VIEW PRODUCT	VIEW PRODUCT
Processor Architecture	64-Bit	32-Bit	32-Bit	32-Bit	32-Bit
Ethernet	1x 10/100/1000M Ethernet + AVB	2x 10/100/1000M Ethernet + AVB	10/100/1000 Mbit/s	Dual 10/100 Mbit/s	10/100/1000 Mbit/s
Operating Temperature	Industrial: -40° C to 85° C (-40° F to 185° F), depending on use case and enclosure/system design	Industrial: -40° C to 85° C (-40° F to 185° F) (depending on use case and enclosure/system design) Commercial: 0° C to 70° C (32° F to 158° F)	-20 to 70° C / -40 to 85° C	-40° C to +85° C	-20 to 70C / -40 to 85C
Processor Cores	4	4	Up to 4	1	Up to 4
Wireless	802.11a/b/g/n/ac, Bluetooth 5	802.11a/b/g/n/ac, Bluetooth 5	802.11a/b/g/n/ac, Bluetooth 5	802.11a/b/g/n/ac, Bluetooth 5	802.11a/b/g/n, Bluetooth 4.0
Graphics	GC7000UL with OpenCL and Vulkan support, 2 shader, 123 million triangles / sec, 0.8 giga pixel / sec, 12.8 GFLOPs 32-bit / 12.8 GFLOPs 16-bit, supports OpenGL ES 1.1, 2.0, 3.0, OpenCL, shader clock frequency of 500 MHz LCDIF display controller, supporting up to 1080p 60fps display through MIPI DSI, 4-lane MIPI DSI interface	Multi-stream-capable HD video engine with H.265 (4Kp30), H.264 (1080p60), VP6/VP8 (1080p60), MPEG-2 (1080p60), MPEG4 (1080p), RealVideo (1080p) decode and H.264 (1080p30) encode; 3D video playback in HD in high-performance families; Superior 3D graphics performance with up to four shaders	Multi-stream-capable HD video engine with 1080p60 decode, 1080p30 encode and 3D video playback in HD in high-performance families; Superior 3D graphics performance with up to 4 shaders at 200 Mt/s w/OpenCL support; Separate 2D and/or Vertex acceleration engines for UI support; Stereoscopic image sensor support for 3D imaging	2D Pixel Processing Pipeline (PXP) for color-space conversion, scaling, alpha-blending, and rotation, 8-/16-/18-/24-bit parallel LCD Display up to WXGA (1366x768)	Multi-stream-capable HD video engine with 1080p60 decode, 1080p30 encode and 3D video playback in HD in high-performance families; Superior 3D graphics performance with up to 4 shaders at 200 Mt/s w/OpenCL support; Separate 2D and/or Vertex acceleration engines for UI support; Stereoscopic image sensor support for 3D imaging
Processor Family	Arm Cortex-A53	ARM Cortex-A35	ARM Cortex-A9	ARM Cortex-A7	ARM Cortex-A9
I/O	1x USB 2.0 OTG controllers with integrated PHY interfaces, 3x Ultra Secure Digital Host Controller (uSDHC) interfaces, 1x Gigabit Ethernet controller, 4x Universal Asynchronous Receiver / Transmitter (UART) modules, 4x I2C modules, 3x SPI modules	1x SD 3.0 card interface handles SD/SDIO/MMC protocols, 5x UARTs (4x Cortex-A35 core, 1x Cortex-M4), S/PDIF Tx/Rx, 8x I2C, 4x SPI, ESAI, 4x I2S/SSI, 3x FlexCAN, MLB150 + DTCP, USB 3.0 OTG with PHY, USB 2.0 OTG with PHY, 4x PWM, GPIO, Keypad, PCIe 3.0, 2x MIPI DSI/LVDS, MIPI CSI, 8/10-bit CSI, 24-bit RGB, RTC, Watchdog, Timers, JTAG	MMC 4.4/SD 3.0 x3MMC 4.4/SDXC, UART x5 (5 Mbps), MIPI HSI, S/PDIF Tx/Rx, I2C x3, SPI x5, FlexCAN x2, MLB150 + DTCP, S-ATA and PHY (3 Gbps), USB2 OTG and PHY, USB 2.0 Host and PHY, USB 2.0 HSIC Host x2, PWM, 3.3V GPIO, Keypad, PCIe 2.0 (x1 lane), HDMI and PHY, MIPI DSI, MIPI CSI2, 20-bit CSI, 24-bit RGB, LVDS (x2), RTC, External address/data bus, Watchdog, Timers, JTAG, External Memory Bus	1 x dedicated MMC 4.5/SD 3.0/SDIO Port (1-/2-4-bit), 2 x USB 2.0 OTG with PHY, 3x I2S/SAI, 1 x S/PDIF Tx/Rx, 2 x FlexCAN (2.0b), 4 x I2C, 4 x SPI, 7 x UART, 4 x Timer, 8 x PWM, 3 x Watchdog, 2 x 12-bit ADC (10 channels) with 4-wire/5-wire touch controller, up to 103 GPIOs, 16-bit address / up to 16-bit data (multiplexed and non-multiplexed modes)	MMC 4.4/SD 3.0 x3MMC 4.4/SDXC, UART x5 (5 Mbps), MIPI HSI, S/PDIF Tx/Rx, I2C x3, SPI x5, FlexCAN x2, MLB150 + DTCP, S-ATA and PHY (3 Gbps), USB2 OTG and PHY, USB 2.0 Host and PHY, USB 2.0 HSIC Host x2, PWM, 3.3V GPIO, Keypad, PCIe 2.0 (x1 lane), HDMI and PHY, MIPI DSI, MIPI CSI2, 20-bit CSI, 24-bit RGB, LVDS (x2), RTC, External address/data bus, Watchdog, Timers, JTAG, External Memory Bus
Processor Frequency	Up to 1.4 GHz	Up to 1.0 GHz	Up to 1.2 GHz	528 MHz	Up to 1.2 GHz
Processor	NXP i.MX8 Nano	NXP i.MX8QuadXPlus	NXP i.MX6	NXP i.MX6UL	NXP i.MX6
RAM	Up to 1 GB of LPDDR4	Up to 4 GB LPDDR4	Up to 2 GB DDR3	Up to 1 GB DDR3	Up to 2 GB DDR3
Flash	Up to 8 GB eMMC	Up to 64 GB eMMC	Up to 64 GB eMMC	Up to 2 GB NAND (SLC)	Up to 64 GB eMMC
Software Support	Yocto Project Linux	Yocto Project Linux, Android	Yocto Project Linux, Android	Yocto Project Linux	Yocto Project Linux, Android, Windows Embedded Compact
Other	Digi Microcontroller Assist, independent Cortex-M0+ microcontroller subsystem, supporting ultra-low power modes @ <3μA	-	Up to 4 displays, up to 3 cameras, Kinetis Micro Controller Assist (MCA)	Kinetis Micro Controller Assist (MCA), Secure Element (SE)	Up to 4 displays, up to 3 cameras, Kinetis Micro Controller Assist (MCA)
Audio	-	-	ESAI, I2S/SSI x3	3x I2S/SAI, 1 x S/PDIF Tx/Rx	ESAI, I2S/SSI x3,
	View Specifications	View Specifications	View Specifications	View Specifications	View Specifications

· 제품 사양

SPECIFICATIONS	Digi ConnectCore® 8M Nano
APPLICATION PROCESSOR	NXP i.MX8 Nano 4x Cortex-A53 cores @ 1.4 GHz 1x Cortex-M7 core @ 750 MHz core for real-time processing
MEMORY	Up to 8 GB eMMC, up to 1 GB of LPDDR4 (16-bit)
PMIC	Rohm BD71850MWV
GRAPHICS	Graphic Processing Unit: GC7000UL with OpenCL and Vulkan support 2 shader 123 million triangles / sec 0.8 giga pixel / sec 12.8 GFLOPs 32-bit / 12.8 GFLOPs 16-bit Supports OpenGL ES 1.1, 2.0, 3.0, OpenCL Shader clock frequency of 500 MHz LCDIF display controller, supporting up to 1080p 60fps display through MIPI DSI; 4-lane MIPI DSI interface
SECURITY	Digi TrustFence®, TRNG, TrustZone, Secure RTC, Secure JTAG, Secure Element
PERIPHERALS/ INTERFACES	1x USB 2.0 OTG controllers with integrated PHY interfaces 3x Ultra Secure Digital Host Controller (uSDHC) interfaces 1x Gigabit Ethernet controller 4x Universal Asynchronous Receiver / Transmitter (UART) modules 4x I2C modules 3x SPI modules
ETHERNET	1x 10/100/1000M Ethernet + AVB
WI-FI	1x1 802.11a/b/g/n/ac dual-band wireless
BLUETOOTH	Bluetooth® 5
ON-MODULE MICROCONTROLLER ASSIST	Digi Microcontroller Assist™ Independent Cortex-M0+ microcontroller subsystem Supporting ultra-low power modes @ <3µA
OPERATING TEMPERATURE	Industrial: -40° C to 85° C (-40° F to 185° F); depending on use case and enclosure/system design
STORAGE TEMPERATURE	-50° C to 125° C (-58° F to 257° F)
RELATIVE HUMIDITY	5% to 90% (non-condensing)
RADIO APPROVALS	US, Canada, EU, Japan, Australia/New Zealand
EMISSIONS/ IMMUNITY/ SAFETY	FCC Part 15 Class B, EN 55022 Class B, EN 61000-3-2, EN 61000-3-3, ICES- 003 Class B, VCCI Class II, AS 3548; FCC Part 15 Subpart C Section 15.247, IC (Industry Canada), RSS-210 Issue 5 Section 6.2.2(o), EN 300 328, EN 301 489-17, EN 55024, EN 301 489-3
DESIGN VERIFICATION	Temperature: IEC 60068-2-1, IEC 60068-2-2, IEC 60068-2-78 Vibration/Shock: IEC 60068-2-6, IEC 60068-2-64, IEC 60068-2-27, HALT
MECHANICAL DIMENSIONS	118 castellated vias, LGA-474, 1.27 mm pitch, fully shielded for radio emissions and thermal management (heat-spreading) 40 mm x 45 mm x 3.5 mm (1.6 in x 1.8 in x 0.1 in)
PRODUCT WARRANTY	3-year

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