Digi ConnectCore 8M Nano

Embedded system-on-module based on the NXP i.MX 8M Nano processor; designed for longevity and scalability in industrial IoT applications

Digi ConnectCore 8X

Intelligent and connected embedded system-on-module based on the NXP i.MX 8X, with scalable dual/quad-core performance for industrial IoT applications

Digi ConnectCore 6+

NXP i.MX6Plus based surface-mount module solution with scalable, quad-core performance and integrated wireless

Digi ConnectCore 6UL

The Industry’s smallest wireless low-power NXP i.MX6UL UltraLite System-on-Module platform to build your intelligent and secure connected devices

Digi ConnectCore 6

NXP i.MX6 based surface-mount module solution with scalable, single-/multi-core performance and integrated wireless

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Processor Architecture

64-Bit

32-Bit

32-Bit

32-Bit

32-Bit

Ethernet

1x 10/100/1000M Ethernet + AVB

2x 10/100/1000M Ethernet + AVB

10/100/1000 Mbit/s

Dual 10/100 Mbit/s

10/100/1000 Mbit/s

Operating Temperature

Industrial: -40° C to 85° C (-40° F to 185° F), depending on use case and enclosure/system design

Industrial: -40° C to 85° C (-40° F to 185° F) (depending on use case and enclosure/system design) Commercial: 0° C to 70° C (32° F to 158° F)

-20 to 70° C / -40 to 85° C

-40° C to +85° C

-20 to 70C / -40 to 85C

Processor Cores

4

4

Up to 4

1

Up to 4

Wireless

802.11a/b/g/n/ac, Bluetooth 5

802.11a/b/g/n/ac, Bluetooth 5

802.11a/b/g/n/ac, Bluetooth 5

802.11a/b/g/n/ac, Bluetooth 5

802.11a/b/g/n, Bluetooth 4.0

Graphics

GC7000UL with OpenCL and Vulkan support, 2 shader, 123 million triangles / sec, 0.8 giga pixel / sec, 12.8 GFLOPs 32-bit / 12.8 GFLOPs 16-bit, supports OpenGL ES 1.1, 2.0, 3.0, OpenCL, shader clock frequency of 500 MHz LCDIF display controller, supporting up to 1080p 60fps display through MIPI DSI, 4-lane MIPI DSI interface

Multi-stream-capable HD video engine with H.265 (4Kp30), H.264 (1080p60), VP6/VP8 (1080p60), MPEG-2 (1080p60), MPEG4 (1080p), RealVideo (1080p) decode and H.264 (1080p30) encode; 3D video playback in HD in high-performance families; Superior 3D graphics performance with up to four shaders

Multi-stream-capable HD video engine with 1080p60 decode, 1080p30 encode and 3D video playback in HD in high-performance families; Superior 3D graphics performance with up to 4 shaders at 200 Mt/s w/OpenCL support; Separate 2D and/or Vertex acceleration engines for UI support; Stereoscopic image sensor support for 3D imaging

2D Pixel Processing Pipeline (PXP) for color-space conversion, scaling, alpha-blending, and rotation, 8-/16-/18-/24-bit parallel LCD Display up to WXGA (1366x768)

Multi-stream-capable HD video engine with 1080p60 decode, 1080p30 encode and 3D video playback in HD in high-performance families; Superior 3D graphics performance with up to 4 shaders at 200 Mt/s w/OpenCL support; Separate 2D and/or Vertex acceleration engines for UI support; Stereoscopic image sensor support for 3D imaging

Processor Family

Arm Cortex-A53

ARM Cortex-A35

ARM Cortex-A9

ARM Cortex-A7

ARM Cortex-A9

I/O

1x USB 2.0 OTG controllers with integrated PHY interfaces, 3x Ultra Secure Digital Host Controller (uSDHC) interfaces, 1x Gigabit Ethernet controller, 4x Universal Asynchronous Receiver / Transmitter (UART) modules, 4x I2C modules, 3x SPI modules

1x SD 3.0 card interface handles SD/SDIO/MMC protocols, 5x UARTs (4x Cortex-A35 core, 1x Cortex-M4), S/PDIF Tx/Rx, 8x I2C, 4x SPI, ESAI, 4x I2S/SSI, 3x FlexCAN, MLB150 + DTCP, USB 3.0 OTG with PHY, USB 2.0 OTG with PHY, 4x PWM, GPIO, Keypad, PCIe 3.0, 2x MIPI DSI/LVDS, MIPI CSI, 8/10-bit CSI, 24-bit RGB, RTC, Watchdog, Timers, JTAG

MMC 4.4/SD 3.0 x3MMC 4.4/SDXC, UART x5 (5 Mbps), MIPI HSI, S/PDIF Tx/Rx, I2C x3, SPI x5, FlexCAN x2, MLB150 + DTCP, S-ATA and PHY (3 Gbps), USB2 OTG and PHY, USB 2.0 Host and PHY, USB 2.0 HSIC Host x2, PWM, 3.3V GPIO, Keypad, PCIe 2.0 (x1 lane), HDMI and PHY, MIPI DSI, MIPI CSI2, 20-bit CSI, 24-bit RGB, LVDS (x2), RTC, External address/data bus, Watchdog, Timers, JTAG, External Memory Bus

1 x dedicated MMC 4.5/SD 3.0/SDIO Port (1-/2-4-bit), 2 x USB 2.0 OTG with PHY, 3x I2S/SAI, 1 x S/PDIF Tx/Rx, 2 x FlexCAN (2.0b), 4 x I2C, 4 x SPI, 7 x UART, 4 x Timer, 8 x PWM, 3 x Watchdog, 2 x 12-bit ADC (10 channels) with 4-wire/5-wire touch controller, up to 103 GPIOs, 16-bit address / up to 16-bit data (multiplexed and non-multiplexed modes)

MMC 4.4/SD 3.0 x3MMC 4.4/SDXC, UART x5 (5 Mbps), MIPI HSI, S/PDIF Tx/Rx, I2C x3, SPI x5, FlexCAN x2, MLB150 + DTCP, S-ATA and PHY (3 Gbps), USB2 OTG and PHY, USB 2.0 Host and PHY, USB 2.0 HSIC Host x2, PWM, 3.3V GPIO, Keypad, PCIe 2.0 (x1 lane), HDMI and PHY, MIPI DSI, MIPI CSI2, 20-bit CSI, 24-bit RGB, LVDS (x2), RTC, External address/data bus, Watchdog, Timers, JTAG, External Memory Bus

Processor Frequency

Up to 1.4 GHz

Up to 1.0 GHz

Up to 1.2 GHz

528 MHz

Up to 1.2 GHz

Processor

NXP i.MX8 Nano

NXP i.MX8QuadXPlus

NXP i.MX6

NXP i.MX6UL

NXP i.MX6

RAM

Up to 1 GB of LPDDR4

Up to 4 GB LPDDR4

Up to 2 GB DDR3

Up to 1 GB DDR3

Up to 2 GB DDR3

Flash

Up to 8 GB eMMC

Up to 64 GB eMMC

Up to 64 GB eMMC

Up to 2 GB NAND (SLC)

Up to 64 GB eMMC

Software Support

Yocto Project Linux

Yocto Project Linux, Android

Yocto Project Linux, Android

Yocto Project Linux

Yocto Project Linux, Android, Windows Embedded Compact

Other

Digi Microcontroller Assist, independent Cortex-M0+ microcontroller subsystem, supporting ultra-low power modes @ <3μA

-

Up to 4 displays, up to 3 cameras, Kinetis Micro Controller Assist (MCA)

Kinetis Micro Controller Assist (MCA), Secure Element (SE)

Up to 4 displays, up to 3 cameras, Kinetis Micro Controller Assist (MCA)

Audio

-

-

ESAI, I2S/SSI x3

3x I2S/SAI, 1 x S/PDIF Tx/Rx

ESAI, I2S/SSI x3,

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APPLICATION PROCESSOR

NXP i.MX8QuadXPlus

MEMORY

Up to 64 GB eMMC, up to 4GB of LPDDR4

PMIC

NXP PF8100

GRAPHICS

Multi-stream-capable HD video engine with H.265 (4Kp30), H.264 (1080p60), VP6/VP8 (1080p60), MPEG-2 (1080p60), MPEG4 (1080p), RealVideo (1080p) decode and H.264 (1080p30) encode; 3D video playback in HD in high-performance families; Superior 3D graphics performance with up to four shaders

SECURITY

Digi TrustFence®, TRNG, TrustZone, Ciphers, Security Cntrl, Secure RTC, Secure JTAG, eFuses (OTP)

PERIPHERALS/ INTERFACES

1x SD 3.0 card interface handles SD/SDIO/MMC protocols (1x additional one reserved on the SOM for supporting eMMC),
5x UARTs (4x UARTs from Cortex-A35 core, 1x UART from Cortex-M4), S/PDIF Tx/Rx,
8x I² C (4xI²C high-speed DMA support 4x I²C low-speed no DMA support),
4x SPI, ESAI, 4x I²S/SSI, 3x FlexCAN, MLB150 + DTCP, USB 3.0 OTG with PHY, USB 2.0 OTG with PHY,
4x PWM, GPIO, Keypad, PCIe 3.0 (x1 lane), 2x MIPI DSI/LVDS, MIPI CSI, 8/10-bit CSI,
24-bit RGB, RTC, Watchdog, Timers, JTAG

ETHERNET

2x 10/100/1000M Ethernet + AVB

WI-FI

802.11a/b/g/n/ac: 2.412 - 2.484 GHz, 4.900 - 5.850 GHz
802.11b: 1, 2, 5.5, 11 Mbps (17 dBm typical ±2 dBm)
802.11a/g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps (15 dBm typical ±2 dBm)
802.11n: 15, 30, 45, 60, 90, 120, 135, 150 Mbps (12 dBm typical ±2 dBm) HT40, MCS 0-7
802.11ac: 15, 30, 45, 60, 90, 120, 135, 150, 180, 200 Mbps (10 dBm typical ±2 dBm) HT40, MCS 0-9
Note: all data rates provided above are for 1 spatial stream. For 2x spatial steams, double the data rate.
Security: WEP, WPA-PSK/WPA2-personal, WPA/WPA2-enterprise, 802.11i, Access Point Mode (up to 10 clients), Wi-Fi Direct
Industry certifications: Wi-Fi Alliance Logo Certification Ready, CCXv4 ASD Ready

BLUETOOTH

Bluetooth 5

ON-MODULE MICROCONTROLLER ASSIST

Digi Microcontroller Assist™

OPERATING TEMPERATURE

Industrial: -40° C to 85° C (-40° F to 185° F) (depending on use case and enclosure/system design)
Commercial: 0° C to 70° C (32° F to 158° F)

STORAGE TEMPERATURE

-50° C to 125° C (-58° F to 257° F)

RELATIVE HUMIDITY

5% to 90% (non-condensing)

RADIO APPROVALS

US, Canada, EU, Japan, Australia/New Zealand

EMISSIONS/ IMMUNITY/ SAFETY

FCC Part 15 Class B, EN 55022 Class B, EN 61000-3-2, EN 61000-3-3, ICES- 003 Class B, VCCI Class II, AS 3548,
FCC Part 15 Subpart C Section 15.247, IC (Industry Canada), RSS-210 Issue 5 Section 6.2.2(o), EN 300 328, EN 301 489-17, EN 55024, EN 301 489-3

DESIGN VERIFICATION

Temperature: IEC 60068-2-1, IEC 60068-2-2, IEC 60068-2-78
Vibration/Shock: IEC 60068-2-6, IEC 60068-2-64, IEC 60068-2-27, HALT

MECHANICAL DIMENSIONS

118 castellated vias, LGA-474, 1.27 mm pitch, fully shielded for radio emissions and thermal management (heat-spreading) 40 mm x 45 mm x 3.5 mm

PRODUCT WARRANTY

3-year