Digi ConnectCore® 6 > System-On-Modules

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Digi ConnectCore® 6 요약정보 및 구매

MODEL : Digi ConnectCore® 6

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브랜드	DIGI
판매가격	전화문의 (031-713-5988)
포인트	0점
배송정보	유료(주문시 결제) 점포택배 / 평균 7일 이내 도착(토,일,공휴일 제외)

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Digi ConnectCore® 6

확장 가능한 싱글/멀티 코어 성능과 통합 무선 기능을 갖춘 NXP i.MX6 기반 표면 실장 모듈 솔루션

> 확장 가능한 Cortex-A9 멀티 코어 성능

> 독립적 인 Cortex-M0+ / Cortex-M4 마이크로 컨트롤러 Assist ™ 서브 시스템

> 비용 효율적이고 안정적인 로우 프로파일 표면 실장 모듈 폼 팩터> 사전 인증된 802.11 a/b/g/n 및 Bluetooth 4.0 연결

> PMIC를 통한 스마트 전원 관리 아키텍처

> 안드로이드, Yocto 프로젝트 리눅스 및 윈도우즈 임베디드 컴펙트 소프트웨어 플랫폼 지원

> IEC 60068 및 HALT 검증을 통한 안정적인 설계>신뢰성과 장기 가용성을 고려한 설계

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Digi ConnectCore 6는 NXP i.MX6 Cortex-A9 프로세서 제품군을 기반으로 하는 초소형 시스템 온 모듈 솔루션입니다.

최대 1.2GHz의 프로세서 속도와 완벽하게 핀 호환되는 싱글/듀얼/쿼드 코어를 갖춘 ConnectCore 6는 확장 가능한 성능과 사전 인증된 무선 802.11 a/b/g/n과 BLE(Bluetooth Low Energy)를 포함한 Bluetooth 4.0을 갖춘 진정한 미래 보장 플랫폼 솔루션을 제공합니다.

로우 프로파일, 표면 실장 설계는 가장 까다로운 쿼드 코어 시스템 구성에서도 최적화된 방열 기능을 통해 비용 효율적이고 안정적인 폼 팩터로 통합 유연성을 극대화하고 설계 위험을 크게 줄입니다.

ConnectCore 6에는 Digi Remote Manager®를 통한 안전한 원격 관리 및 웹 서비스를 지원하는 Linux 및 Android 플랫폼을 위한 완벽한 BSP (Board Support Package)가 제공됩니다.

* 시스템 온 모듈 비교

	Digi ConnectCore 8M Nano Embedded system-on-module based on the NXP i.MX 8M Nano processor; designed for longevity and scalability in industrial IoT applications	Digi ConnectCore 8X Intelligent and connected embedded system-on-module based on the NXP i.MX 8X, with scalable dual/quad-core performance for industrial IoT applications	Digi ConnectCore 6+ NXP i.MX6Plus based surface-mount module solution with scalable, quad-core performance and integrated wireless	Digi ConnectCore 6UL The Industry’s smallest wireless low-power NXP i.MX6UL UltraLite System-on-Module platform to build your intelligent and secure connected devices	Digi ConnectCore 6 NXP i.MX6 based surface-mount module solution with scalable, single-/multi-core performance and integrated wireless
	VIEW PRODUCT	VIEW PRODUCT	VIEW PRODUCT	VIEW PRODUCT	VIEW PRODUCT
Processor Architecture	64-Bit	32-Bit	32-Bit	32-Bit	32-Bit
Ethernet	1x 10/100/1000M Ethernet + AVB	2x 10/100/1000M Ethernet + AVB	10/100/1000 Mbit/s	Dual 10/100 Mbit/s	10/100/1000 Mbit/s
Operating Temperature	Industrial: -40° C to 85° C (-40° F to 185° F), depending on use case and enclosure/system design	Industrial: -40° C to 85° C (-40° F to 185° F) (depending on use case and enclosure/system design) Commercial: 0° C to 70° C (32° F to 158° F)	-20 to 70° C / -40 to 85° C	-40° C to +85° C	-20 to 70C / -40 to 85C
Processor Cores	4	4	Up to 4	1	Up to 4
Wireless	802.11a/b/g/n/ac, Bluetooth 5	802.11a/b/g/n/ac, Bluetooth 5	802.11a/b/g/n/ac, Bluetooth 5	802.11a/b/g/n/ac, Bluetooth 5	802.11a/b/g/n, Bluetooth 4.0
Graphics	GC7000UL with OpenCL and Vulkan support, 2 shader, 123 million triangles / sec, 0.8 giga pixel / sec, 12.8 GFLOPs 32-bit / 12.8 GFLOPs 16-bit, supports OpenGL ES 1.1, 2.0, 3.0, OpenCL, shader clock frequency of 500 MHz LCDIF display controller, supporting up to 1080p 60fps display through MIPI DSI, 4-lane MIPI DSI interface	Multi-stream-capable HD video engine with H.265 (4Kp30), H.264 (1080p60), VP6/VP8 (1080p60), MPEG-2 (1080p60), MPEG4 (1080p), RealVideo (1080p) decode and H.264 (1080p30) encode; 3D video playback in HD in high-performance families; Superior 3D graphics performance with up to four shaders	Multi-stream-capable HD video engine with 1080p60 decode, 1080p30 encode and 3D video playback in HD in high-performance families; Superior 3D graphics performance with up to 4 shaders at 200 Mt/s w/OpenCL support; Separate 2D and/or Vertex acceleration engines for UI support; Stereoscopic image sensor support for 3D imaging	2D Pixel Processing Pipeline (PXP) for color-space conversion, scaling, alpha-blending, and rotation, 8-/16-/18-/24-bit parallel LCD Display up to WXGA (1366x768)	Multi-stream-capable HD video engine with 1080p60 decode, 1080p30 encode and 3D video playback in HD in high-performance families; Superior 3D graphics performance with up to 4 shaders at 200 Mt/s w/OpenCL support; Separate 2D and/or Vertex acceleration engines for UI support; Stereoscopic image sensor support for 3D imaging
Processor Family	Arm Cortex-A53	ARM Cortex-A35	ARM Cortex-A9	ARM Cortex-A7	ARM Cortex-A9
I/O	1x USB 2.0 OTG controllers with integrated PHY interfaces, 3x Ultra Secure Digital Host Controller (uSDHC) interfaces, 1x Gigabit Ethernet controller, 4x Universal Asynchronous Receiver / Transmitter (UART) modules, 4x I2C modules, 3x SPI modules	1x SD 3.0 card interface handles SD/SDIO/MMC protocols, 5x UARTs (4x Cortex-A35 core, 1x Cortex-M4), S/PDIF Tx/Rx, 8x I2C, 4x SPI, ESAI, 4x I2S/SSI, 3x FlexCAN, MLB150 + DTCP, USB 3.0 OTG with PHY, USB 2.0 OTG with PHY, 4x PWM, GPIO, Keypad, PCIe 3.0, 2x MIPI DSI/LVDS, MIPI CSI, 8/10-bit CSI, 24-bit RGB, RTC, Watchdog, Timers, JTAG	MMC 4.4/SD 3.0 x3MMC 4.4/SDXC, UART x5 (5 Mbps), MIPI HSI, S/PDIF Tx/Rx, I2C x3, SPI x5, FlexCAN x2, MLB150 + DTCP, S-ATA and PHY (3 Gbps), USB2 OTG and PHY, USB 2.0 Host and PHY, USB 2.0 HSIC Host x2, PWM, 3.3V GPIO, Keypad, PCIe 2.0 (x1 lane), HDMI and PHY, MIPI DSI, MIPI CSI2, 20-bit CSI, 24-bit RGB, LVDS (x2), RTC, External address/data bus, Watchdog, Timers, JTAG, External Memory Bus	1 x dedicated MMC 4.5/SD 3.0/SDIO Port (1-/2-4-bit), 2 x USB 2.0 OTG with PHY, 3x I2S/SAI, 1 x S/PDIF Tx/Rx, 2 x FlexCAN (2.0b), 4 x I2C, 4 x SPI, 7 x UART, 4 x Timer, 8 x PWM, 3 x Watchdog, 2 x 12-bit ADC (10 channels) with 4-wire/5-wire touch controller, up to 103 GPIOs, 16-bit address / up to 16-bit data (multiplexed and non-multiplexed modes)	MMC 4.4/SD 3.0 x3MMC 4.4/SDXC, UART x5 (5 Mbps), MIPI HSI, S/PDIF Tx/Rx, I2C x3, SPI x5, FlexCAN x2, MLB150 + DTCP, S-ATA and PHY (3 Gbps), USB2 OTG and PHY, USB 2.0 Host and PHY, USB 2.0 HSIC Host x2, PWM, 3.3V GPIO, Keypad, PCIe 2.0 (x1 lane), HDMI and PHY, MIPI DSI, MIPI CSI2, 20-bit CSI, 24-bit RGB, LVDS (x2), RTC, External address/data bus, Watchdog, Timers, JTAG, External Memory Bus
Processor Frequency	Up to 1.4 GHz	Up to 1.0 GHz	Up to 1.2 GHz	528 MHz	Up to 1.2 GHz
Processor	NXP i.MX8 Nano	NXP i.MX8QuadXPlus	NXP i.MX6	NXP i.MX6UL	NXP i.MX6
RAM	Up to 1 GB of LPDDR4	Up to 4 GB LPDDR4	Up to 2 GB DDR3	Up to 1 GB DDR3	Up to 2 GB DDR3
Flash	Up to 8 GB eMMC	Up to 64 GB eMMC	Up to 64 GB eMMC	Up to 2 GB NAND (SLC)	Up to 64 GB eMMC
Software Support	Yocto Project Linux	Yocto Project Linux, Android	Yocto Project Linux, Android	Yocto Project Linux	Yocto Project Linux, Android, Windows Embedded Compact
Other	Digi Microcontroller Assist, independent Cortex-M0+ microcontroller subsystem, supporting ultra-low power modes @ <3μA	-	Up to 4 displays, up to 3 cameras, Kinetis Micro Controller Assist (MCA)	Kinetis Micro Controller Assist (MCA), Secure Element (SE)	Up to 4 displays, up to 3 cameras, Kinetis Micro Controller Assist (MCA)
Audio	-	-	ESAI, I2S/SSI x3	3x I2S/SAI, 1 x S/PDIF Tx/Rx	ESAI, I2S/SSI x3,
	View Specifications	View Specifications	View Specifications	View Specifications	View Specifications

· 제품 사양

Specifications	Digi ConnectCore 6
Application Processor	NXP i.MX6Solo/DualLite/Dual/Quad with up to four Cortex-A9 cores Industrial (800/850 MHz), Commercial (1/1.2 GHz) i.MX6 variants 32 KB I-Cache/32 KB D-Cache, up to 1 MB L2-Cache
Memory	Up to 64 GB eMMC flash, up to 2 GB DDR3 (64-bit)
PMIC	Dialog DA9063
Graphics	Multi-stream-capable HD video engine with 1080p60 decode, 1080p30 encode and 3D video playback in HD in high-performance families; Superior 3D graphics performance with up to 4 shaders at 200 Mt/s w/OpenCL support; Separate 2D and/or Vertex acceleration engines for UI support; Stereoscopic image sensor support for 3D imaging
Security	RNG, TrustZone, Ciphers, Security Cntrl, Secure RTC, Secure JTAG, eFuses (OTP)
Peripherals/Interfaces	MMC 4.4/SD 3.0 x3MMC 4.4/SDXC, UART x5 (5 Mbps), MIPI HSI, S/PDIF Tx/Rx, I2C x3, SPI x5, ESAI, I2S/SSI x3, FlexCAN x2, MLB150 + DTCP, S-ATA and PHY (3 Gbps), USB2 OTG and PHY, USB 2.0 Host and PHY, USB 2.0 HSIC Host x2, PWM, 3.3V GPIO, Keypad, PCIe 2.0 (x1 lane), HDMI and PHY, MIPI DSI, MIPI CSI2, 20-bit CSI, 24-bit RGB, LVDS (x2), RTC, External address/data bus, Watchdog, Timers, JTAG
External Bus	26-bit address / up to 32-bit data (multiplexed and non-multiplexed modes)
Ethernet	1 Gbit Ethernet + IEEE 1588 (MII10, MII100, RMII, RGMII)
Wi-Fi	802.11a/b/g/n: 2.412 - 2.484 GHz, 4.900 - 5.850 GHz 802.11b: 1, 2, 5.5, 11 Mbps (17 dBm typical ±2 dBm) 802.11a/g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps (15 dBm typical ±2 dBm) 802.11n: 15, 30, 45, 60, 90, 120, 135, 150 Mbps (12 dBm typical ±2 dBm) HT40, MCS 0-7 Security: WEP, WPA-PSK/WPA2-personal, WPA/WPA2 enterprise, 802.11i, access point mode (up to 10 clients), Wi-Fi Direct Industry certifications: Wi-Fi Alliance Logo Certification Ready, CCXv4 ASD Ready
Bluetooth	Profiles: GAP, SPP, FTP, PAN, OPP, HID, A2DP, AVRCP, HDP
On-Module Microcontroller Assist	Kinetis L: MKL14Z32VFT4, MKL14Z64VFT4, MKL15Z128VFT4, MKL15Z32VFT4, MKL15Z64VFT4, MKL24Z32VFT4, MKL24Z64VFT4, MKL25Z128VFT4, MKL25Z32VFT4, MKL25Z64VFT4, MKL26Z128VFT4, MKL26Z64VFT4, MKL26Z32VFT4 Kinetis K: K10P48M50SF0, K20P48M50SF0 Internal interconnect to i.MX6 via SPI, Kinetis interfaces available on module pads
Operating Temperature (Tj)	Industrial: -40° C to 85° C (-40° F to 185° F) / Commercial: 0° C to 70 C° (-32° F to 158° F) Depending on use-case and enclosure/system design
Storage Temperature	-50° C to 125° C (-58° F to 257° F)
Relative Humidity	Relative Humidity 5% to 90% (non-condensing)
Radio Approvals	US, Canada, EU, Japan, Australia/New Zealand
Emissions / Immunity / Safety	FCC Part 15 Class B, EN 55022 Class B, EN 61000-3-2, EN 61000-3-3, ICES-003 Class B, VCCI Class II, AS 3548, FCC Part 15 Subpart C Section 15.247, IC (Industry Canada), RSS-210 Issue 5 Section 6.2.2(o), EN 300 328, EN 301 489-17, EN 55024, EN 301 489-3, Safety UL/UR (or equivalent)
Design Verification	Temperature: IEC 60068-2-1, IEC 60068-2-2, IEC 60068-2-78 Vibration/Shock: IEC 60068-2-6, IEC 60068-2-64, IEC 60068-2-27, HALT
Mechanical Dimensions	LGA-400, 2 mm pitch, fully shielded (heat-spreading)
Product Warranty	3 years

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